Efeito do condicionamento ácido adicional na resistência de união e Módulo de Weibull de sitemas adesivos aplicados em dentina sadia e afetada por cárie

Abstract

The aim of this study was to evaluate the effect of additional etching with phosphoric acid at 35% in the bond strength and Weibull modulus of two adhesive systems applied to sound and affected dentin. Ninety human molars with coronal carious lesion were sectioned to produce flat coronal superficies with effected dentin surrounded by sound dentin, and allocated in six experimental groups: SB-CT: Single Bond® applied to manufacture s instructions; SB+15: Single Bond® with additional etching for 15s; SB+30: Single Bond® with additional etching for 30s; CF-CT: Clearfil SE Bond® applied to manufacture s instructions; CF+15: Clearfil SE Bond® with additional etching for 15s; CF+30: Clearfil SE Bond® with additional etching for 30s. Afterwards, the crowns were built up with a composite resin and, after 24h, mesiondistal sectioned to produce 2 or 3 slices in each substratum. Thereafter (24h), the slices were trimmed in hourglass shape and submitted to micro-tensile test (n=30). The data were analyzed by three-way ANOVA, Tukey s test (p<0,05) and Weibull analysis. The bond strength to affected dentin was significantly lower than sound dentin for the adhesives systems employed, save SB+30. The additional etching increased the bond strength to affected dentin. To sound dentin, the additional etching increased the bond strength for Clearfil SE Bond®, but decreased for Single Bond®. The Weibull modulus to affected dentin was lower for both adhesives systems. On sound dentin, Single Bond® showed lower Weibull modulus than Clearfil SE Bond® and the additional etching decrease this value. Although the additional etching may increase the bond strength to affected dentin, the means were lower than sound dentin, the same for Weibull modulus. The additional etching may reduce the bond strength and Weibull modulus for Single Bond® to sound dentin and, in opposite, increase for Clearfil SE Bond®